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  Mail:yong8mei@hyglue.com
Heng ying adhesive co.ltd
  Tel:0086-0769-83976527
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  Mail:yong8mei@cnhybond.com
Heng xing adhesive co.ltd
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Evopute industry material co.ltd
  Tel:075529566091
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  Products

Series : silicone sealant
Name :
Model : opt906(3)
Click : 1989

OPT906(3)透明电子灌封有机硅胶
OPT 906(3) transparent electronic silicone pouring sealant
一、产品特点:product features:
    OPT 906(3)是一种深层固化透明型室温固化的缩合型双组分有机硅灌封产品。本产品使用前无需用其它底涂剂,对多数材料有着良好的粘接效果,适用于配件的固定及防水、防尘和防漏电 is a kind of transparent two-component condensation type room temperature curing silicone sealing adhesive. Primer is unnecessary with strong adhesive to most material. It is applied to fixation, dust proof and earth leakage protection of fittings.
 
 二、典型用途:using method and notice
  1、电子配件固定及绝缘;Fixation and insulation of electronic fittings.
  2、电子配件及PCB基板的防潮、防水;Moisture-proof and water-proof of electronic fittings and PCB base plate.
  3、LED显示灯饰电子产品封装;Sealing of LED screen and electronic products.
  4、其它一般绝缘模压。Electric insulation   Mould pressing..
 三、使用工艺:using method
  1、混合之前,A组分需用手动或者机器等方法搅拌均匀,B组分在密闭状态下充分摇匀,打开包装后尽可能一次用完,如有剩余须立即盖好瓶盖。Stirring the A adhesive by hand or with machine before using and stir the B adhesive in a airproof container. Repack the left adhesive.
 
  2、当需要附着于应用材料上时,使用前请确认是否能够附着,然后再应用。Ensure the material can be adhesive before use.
 
  3、A、B重量配比是A:B=10:1,如果需要变更操作性等条件时,应区分于以上比例,应对变更混合比例并进行简易实验后应用。此时,B组分用量越多,固化时间越短,同时,可以使用的时间也越短。Mixed the adhesive in weight ratio: A:B = 10:1. Generally, more B component requires longer curing time.
 
  4、一般而言,6mm以下的模压可以模压后自然脱泡,无须另行脱泡,但在手动混合时,如果模压深度较深,表面及内部可能会发生气泡或针孔,因此应把混合液放入真空容器中,在0.06MPa下至少脱泡5分钟。Mixed the adhesive in the airproof container, with 5min deaeration under 0.06MPa.
 四、固化前后技术参数:technical parameter before and after curing
性能指标performance index
OPT315C  A组分
OPT315C B组分
固化前
外观appearance
无色流体transparent fluid
无色流体transparent fluid
粘度viscosity (cps)
4000~6000
20~130
相对密度relativity density(g/cm3
0.98~1.02
0.98~1.02
A组分:B组分(重量比weight ratio)
10:1
固化类型cured type
双组分缩合脱醇型Two-component condensation dealcoholization type
混合后粘度viscosity after curing(cps)
2000~3000
可操作时间operating time(min)
40~90
初步固化时间surface curing time(hr)
24~48
完全固化时间cured time(hr)
24
硬度hardness(Shore A,24hr)
≥8
抗拉强度tensile strength(MPa)
1.00
剪切强度shear strength(MPa)
1.00
线收缩率linear shrinkage  (%)
0.3
使用温度范围temperature scope(℃)
-60~200
体积电阻率volume  resistivity  (Ω·cm)
1.0×1015
介电强度dielectric strength (kV/·mm)
≥25
介电常数 dielectric constant (1.2MHz)
2.9
耐漏电起痕指数proof tracking index (V)
600
导热系数thermal conductivity[W/(m·K)]
0.15
用途范围application scope
粘接灌封bonding and potting
最大特色biggest feature
透明性好,可深层固化transparent, deep curing
    以上机械性能和电性能数据均在25℃,相对湿度55%固化1天后所测。本公司对测试条件不同或产品改进造成的数据不同不承担相关责任。
The statistics above are tested in 25℃, relative humidity 55% condition, 7 days after curing. Our company is not responsible for the difference which caused by different condition or modified products.
 
 
 五、注意事项:notice
  1、凝胶时间的调整:  mixing time adjust
改变B组分的使用量可以调整凝胶时间(即可操作时间),增大B组分用量可以适当缩短凝胶时间,减少用量则可适当延长凝胶时间。用户可以根据实际情况需要在±20%范围内调整。
Mixed the adhesive in weight ratio: A:B = 10:1. Generally, more B component requires longer curing time. Users can change the ratio according to their need with the scope of ±20%.
 
  2、关于混胶:about the  blend              
    a、A组分与B组分混合后,可以采用手动,亦可采用机械搅拌方式,混合时应避免高速长时间搅拌而产生高温(勿高于38℃),以免操作时间缩短而加快固化,致使来不及操作。。Stirring the A adhesive by hand or with machine and avoid long time stirring which produces heat (lower than 38℃) and shorten operating time which promotes curing during operation.
    b、被灌封产品的表面在灌封前必须加以清洁。Clean and dry and degrease the surface before potting.
    c、采用手动方式进行搅拌时应将粘附在容器底部和侧面的胶料向中间折入数次
Make sure the A component is completely mixed with B component if stir by hand.
 
(使A组分胶料充分接触B组分)。
  3、灌封一般低压电器可以不脱泡,如果灌封高压电器就一定要进行真空脱泡灌封。
Deaeration should be carried on in airproof container under high press. ( low press equipment is not available)
  4、胶料和固化剂应密封贮存。混合好的胶料应一次用完,避免造成浪费。Finish the mixture before it cured.
 
  5、本品属非危险品,但勿入口和眼。These products don’t belong to dangerous goods, but eating or eye touch is forbidden.
  6、此系列胶在固化过程中放出低分子物质,对于耐温性要求比较高的(如7天内可耐180℃以上),可以采用胶体在凝胶后5小时加温几个小时(一般加温的温度小于60℃,2~24小时均可)的后续加速固化工艺,这样对胶体的耐温性有很大帮助。(切忌不要未等小分子物质放出而在完全密闭的电子元气件中使用。)
it is suggested that the mixture should be heated( under 60℃,2~24h) after it is curing for 5h. ( don’t heated in the airproof container until it gives out all the small molecule substance)
  7、B组分为透明液体,随着时间的延长,颜色可能会慢慢变黄或略有分层,但不影响产品的使用。
B component will become yellow after long time but it has no bad effect on the usage.
 六、包装规格: 22Kg/套。(A组分20Kg +B组分2Kg)
Packing: 22Kg/set。(A 20Kg +B 2Kg)
 七、贮存及运输:storage and transport
1、 阴凉干燥处贮存,贮存期为9个月(25℃下)。
The product should be stored under cool, dry condition and the shelf-life can be 9 months under 25℃.
 
  2、此类产品属于非危险品,可按一般化学品运输。These products don’t belong to dangerous goods, so they can be transported as normal   chemicals.
 
  3、胶体的A、B组分均须密封保存,小心在运输过程中泄漏!Sealed the mixture to avoid Leakage.
 
  4、超过保存期限的产品应确认有无异常后方可使用。Products past deadline must be confirmed before use.
 

 
 
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